Local shear stress-strain response of Sn-3.5Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis

Published 2016 View Full Article

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Title
Local shear stress-strain response of Sn-3.5Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis
Authors
Keywords
Solder joint, IMC, Lap-shear, Optical measurement of local displacements, Shear stress, Shear strain, Failure modes
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 680, Issue -, Pages 665-676
Publisher
Elsevier BV
Online
2016-04-30
DOI
10.1016/j.jallcom.2016.04.184

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