Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate

Published 2015 View Full Article

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Title
Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate
Authors
Keywords
Flexible substrate, Cu pillar bump, Sn-58Bi solder bump, thermal shock test, bending test
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 44, Issue 7, Pages 2458-2466
Publisher
Springer Nature
Online
2015-04-17
DOI
10.1007/s11664-015-3781-x
References
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