Effect of Cu–Sn intermetallic compound reactions on the Kirkendall void growth characteristics in Cu/Sn/Cu microbumps

Effects of film thickness and deposition rate on the diffusion barrier performance of titanium nitride in Cu-through silicon vias

(2014) Young-Joo Lee et al.   Electronic Materials Letters

Effects of the microstructure of copper through-silicon vias on their thermally induced linear elastic mechanical behavior

(2014) Zhiyong Wu et al.   Electronic Materials Letters

High speed Cu-Ni filling into TSV for 3-Dimensional Si chip stacking

(2013) Sung Chul Hong et al.   METALS AND MATERIALS INTERNATIONAL

Stencil printing behavior of lead-free Sn-3Ag-0.5Cu solder paste for wafer level bumping for Sub-100 μm size solder bumps

(2013) Santosh Kumar et al.   METALS AND MATERIALS INTERNATIONAL

Measurement of adhesion and bonding strength studies in 3D interconnect structures using atomic force microscopy

(2013) Eunmi Choi et al.   METALS AND MATERIALS INTERNATIONAL

Reduced impedance and superconductivity of SnAgCu solder alloy at high frequency

(2012) Wei Yao et al.   Electronic Materials Letters

A novel high-speed shear test for lead-free flip chip packages

(2012) Seok-Hwan Huh et al.   Electronic Materials Letters

Inhibiting the growth of Cu3Sn and Kirkendall voids in the Cu/Sn-Ag-Cu system by minor Pd alloying

(2012) Cheng En Ho et al.   Electronic Materials Letters

Fabrication of electroplate Sn-Ag bumps without a lithography process for 3D packaging

(2012) Jiheon Jun et al.   METALS AND MATERIALS INTERNATIONAL

Effect of Process Parameters on TSV Formation Using Deep Reactive Ion Etching

(2011) Kwang-Seok Kim et al.   Korean Journal of Metals and Materials

Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing

(2010) Byoung-Joon Kim et al.   JOURNAL OF ELECTRONIC MATERIALS

Secondary IMC formation induced by Kirkendall voiding in Cu/Sn–3.5Ag solder joints

(2010) S.H. Kim et al.   JOURNAL OF MATERIALS RESEARCH

Electrical conductivity and tensile properties of severely cold-worked Cu-P based alloy sheets

(2010) J. M. Kim et al.   METALS AND MATERIALS INTERNATIONAL

Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps

(2009) Gi-Tae Lim et al.   JOURNAL OF ELECTRONIC MATERIALS

Evaluation of Cu-bumps with lead-free solders for flip-chip package applications

(2009) Kung-Liang Lin et al.   MICROELECTRONIC ENGINEERING

Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering

(2008) J. Y. Kim et al.   APPLIED PHYSICS LETTERS