Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits

Thermal-gradient induced abnormal Ni3Sn4 interfacial growth at cold side in Sn2.5Ag alloys for three-dimensional integrated circuits

(2013) Fan-Yi Ouyang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

(2012) Chien-Fu Tseng et al.   JOURNAL OF MATERIALS SCIENCE

Precipitation of large Ag3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging

(2012) Ruo-Wei Yang et al.   MATERIALS CHEMISTRY AND PHYSICS

Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics

(2012) Y.J. Chen et al.   MICROELECTRONICS RELIABILITY

Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish

(2011) Chien-Fu Tseng et al.   MATERIALS LETTERS

Interfacial reaction and elemental redistribution in Sn3.0Ag0.5Cu–xPd/immersion Au/electroless Ni solder joints after aging

(2011) I-Tai Wang et al.   Materials Science and Engineering B-Advanced Functional Solid-State Materials

Elimination of voids in reactions between Ni and Sn: A novel effect of silver

(2011) H.Y. Chuang et al.   SCRIPTA MATERIALIA

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

(2010) K. Sakuma et al.   IBM JOURNAL OF RESEARCH AND DEVELOPMENT

Effects of third element and surface finish on interfacial reactions of Sn–Ag–xCu (or Ni)/(Cu or ENIG) solder joints

(2010) Jeong-Won Yoon et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Fast diffusers in a thermal gradient (solder ball)

(2010) J.R. Lloyd et al.   MICROELECTRONICS RELIABILITY

The influence of solder volume and pad area on Sn–3.8Ag–0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging

(2007) C.K. Wong et al.   MICROELECTRONICS RELIABILITY