Extreme ultraviolet lithography and three dimensional integrated circuit—A review

Enhanced thermal stability of extreme ultraviolet multilayers by balancing diffusion-induced structural changes

(2013) S. L. Nyabero et al.   APPLIED PHYSICS LETTERS

Independent interlayer microfluidic cooling for heterogeneous 3D IC applications

(2013) Yue Zhang et al.   ELECTRONICS LETTERS

Design-Aware Defect-Avoidance Floorplanning of EUV Masks

(2013) Abde Ali Kagalwalla et al.   IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING

Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns

(2012) T. P. Moffat et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Extreme ultraviolet source at 6.7 nm based on a low-density plasma

(2011) Takeshi Higashiguchi et al.   APPLIED PHYSICS LETTERS

Enhancements of extreme ultraviolet emission using prepulsed Sn laser-produced plasmas for advanced lithography applications

(2011) J. R. Freeman et al.   JOURNAL OF APPLIED PHYSICS

Pre-Bond and Post-Bond Test and Signal Recovery Structure to Characterize and Repair TSV Defect Induced Signal Degradation in 3-D System

(2011) Minki Cho et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Systematic investigation of self-absorption and conversion efficiency of 6.7 nm extreme ultraviolet sources

(2010) Takamitsu Otsuka et al.   APPLIED PHYSICS LETTERS

Is 3D chip technology the next growth engine for performance improvement?

(2010) P. G. Emma et al.   IBM JOURNAL OF RESEARCH AND DEVELOPMENT

Electrical Characterization for Intertier Connections and Timing Analysis for 3-D ICs

(2010) Xiaoxia Wu et al.   IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS

Infinitely high selective inductively coupled plasma etching of an indium tin oxide binary mask structure for extreme ultraviolet lithography

(2010) Y. R. Park et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Closed-Form Expressions of 3-D Via Resistance, Inductance, and Capacitance

(2009) Ioannis Savidis et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs

(2009) Guruprasad Katti et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Absorber stack with transparent conductive oxide layer for extreme ultraviolet lithography

(2009) Hee Young Kang et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B