Asymmetrical Precipitation of Ag3Sn Intermetallic Compounds Induced by Thermomigration of Ag in Pb-Free Microbumps During Solid-State Aging

Thermal-gradient induced abnormal Ni3Sn4 interfacial growth at cold side in Sn2.5Ag alloys for three-dimensional integrated circuits

(2013) Fan-Yi Ouyang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Comparison of thermomigration behaviors between Pb-free flip chip solder joints and microbumps in three dimensional integrated circuits: Bump height effect

(2013) Fan-Yi Ouyang et al.   JOURNAL OF APPLIED PHYSICS

Precipitation of large Ag3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging

(2012) Ruo-Wei Yang et al.   MATERIALS CHEMISTRY AND PHYSICS

Thermomigration in solder joints

(2012) Chih Chen et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints

(2011) Fan-Yi Ouyang et al.   JOURNAL OF APPLIED PHYSICS

Elimination of voids in reactions between Ni and Sn: A novel effect of silver

(2011) H.Y. Chuang et al.   SCRIPTA MATERIALIA

Effects of Ag on the Kirkendall void formation of Sn–xAg/Cu solder joints

(2010) Sunghwan Kim et al.   JOURNAL OF APPLIED PHYSICS

Thermomigration in Pb-free SnAg solder joint under alternating current stressing

(2009) Hsiang-Yao Hsiao et al.   APPLIED PHYSICS LETTERS

The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging

(2009) Sun-Kyoung Seo et al.   MICROELECTRONICS RELIABILITY