The micro-mechanism for the effect of Sn grain orientation on substrate consumption in Sn solder joints

Title
The micro-mechanism for the effect of Sn grain orientation on substrate consumption in Sn solder joints
Authors
Keywords
Sn grain orientation, Substrate consumption, Diffusion energy, First principles
Journal
COMPUTATIONAL MATERIALS SCIENCE
Volume 108, Issue -, Pages 1-7
Publisher
Elsevier BV
Online
2015-06-18
DOI
10.1016/j.commatsci.2015.05.029

Ask authors/readers for more resources

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started