EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing

Inhibiting the growth of Cu3Sn and Kirkendall voids in the Cu/Sn-Ag-Cu system by minor Pd alloying

(2012) Cheng En Ho et al.   Electronic Materials Letters

Critical Concerns in Soldering Reactions Arising from Space Confinement in 3-D IC Packages

(2012) H. Y. Chuang et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Eliminate Kirkendall voids in solder reactions on nanotwinned copper

(2012) Tao-Chi Liu et al.   SCRIPTA MATERIALIA

On the root cause of Kirkendall voiding in Cu3Sn

(2011) Liang Yin et al.   JOURNAL OF MATERIALS RESEARCH

Current stressing-induced growth of Cu3Sn in Cu/Sn/Cu solder joints

(2011) Delphic Chen et al.   MATERIALS LETTERS

Elimination of voids in reactions between Ni and Sn: A novel effect of silver

(2011) H.Y. Chuang et al.   SCRIPTA MATERIALIA

Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate

(2008) Jicheng Gong et al.   ACTA MATERIALIA

Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder joints

(2008) Jin Yu et al.   ACTA MATERIALIA