Suppression of Cu 3 Sn layer and formation of multi-orientation IMCs during thermal aging in Cu/Sn–3.5Ag/Cu–15Zn transient liquid-phase bonding in novel 3D-IC Technologies
Suppression of Cu 3 Sn layer and formation of multi-orientation IMCs during thermal aging in Cu/Sn–3.5Ag/Cu–15Zn transient liquid-phase bonding in novel 3D-IC Technologies
Authors
Keywords
Crystal structure, Electron microscopy, Intermetallic alloys and compounds, Metals and alloys, Electronic materials, Semiconductors
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