Formation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy for three-dimensional integrated circuits

Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples

(2013) Shih-kang Lin et al.   JOURNAL OF ELECTRONIC MATERIALS

Overview of transient liquid phase and partial transient liquid phase bonding

(2011) Grant O. Cook et al.   JOURNAL OF MATERIALS SCIENCE

Recent advances on Sn–Cu solders with alloying elements: review

(2011) Guang Zeng et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration

(2011) Eun-Jung Jang et al.   METALS AND MATERIALS INTERNATIONAL

Overview and outlook of through‐silicon via (TSV) and 3D integrations

(2011) John H. Lau   MICROELECTRONICS INTERNATIONAL

Wafer-level Cu–Cu bonding technology

(2011) Ya-Sheng Tang et al.   MICROELECTRONICS RELIABILITY

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

(2010) J.F. Li et al.   ACTA MATERIALIA

Absorption of sulfur dioxide using membrane and enhancement of desorption with ultrasound

(2010) Juan-qin XUE et al.   TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA

Corrosion development between liquid gallium and four typical metal substrates used in chip cooling device

(2009) Yue-Guang Deng et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

First-principles calculations assisted thermodynamic assessment of the Pt–Ga–Ge ternary system

(2009) J.S. Wang et al.   CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY

Wafer-level bonding/stacking technology for 3D integration

(2009) Cheng-Ta Ko et al.   MICROELECTRONICS RELIABILITY

Through-Silicon Via (TSV)

(2009) Makoto Motoyoshi   PROCEEDINGS OF THE IEEE

A thermodynamic assessment of the copper–gallium system

(2008) J.-B. Li et al.   CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY

PANDAT software with PanEngine, PanOptimizer and PanPrecipitation for multi-component phase diagram calculation and materials property simulation

(2008) W. Cao et al.   CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY

Surface Tension of Liquid Alloys—A Thermodynamic Approach

(2008) Kusuhiro Mukai et al.   METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE

Interfacial fracture toughness of Pb-free solders

(2008) S.M. Hayes et al.   MICROELECTRONICS RELIABILITY