Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

Published 2017 View Full Article

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Title
Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate
Authors
Keywords
Pb–free solder, Low–Ag–content solder, Solid–state reaction, Crystal growth, Diffusion kinetics
Journal
MATERIALS CHARACTERIZATION
Volume 124, Issue -, Pages 250-259
Publisher
Elsevier BV
Online
2017-01-08
DOI
10.1016/j.matchar.2017.01.004

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