A metastable phase of tin in 3D integrated circuit solder microbumps

Published 2015 View Full Article

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Title
A metastable phase of tin in 3D integrated circuit solder microbumps
Authors
Keywords
Lead-free solder, Metastable phases, Electronic packaging, Joining
Journal
SCRIPTA MATERIALIA
Volume 102, Issue -, Pages 39-42
Publisher
Elsevier BV
Online
2015-02-25
DOI
10.1016/j.scriptamat.2015.02.009

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