Growth orientation of Cu–Sn IMC in Cu/Sn–3.5Ag/Cu– x Zn microbumps and Zn-doped solder joints

Published 2014 View Full Article

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Title
Growth orientation of Cu–Sn IMC in Cu/Sn–3.5Ag/Cu– x Zn microbumps and Zn-doped solder joints
Authors
Keywords
-
Journal
MATERIALS LETTERS
Volume 134, Issue -, Pages 184-186
Publisher
Elsevier BV
Online
2014-07-17
DOI
10.1016/j.matlet.2014.07.061

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