Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection

Published 2016 View Full Article

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Title
Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection
Authors
Keywords
3D interconnection, Low temperature Cu-Sn bonding, Surface activation, Plasma pretreatment
Journal
APPLIED SURFACE SCIENCE
Volume 384, Issue -, Pages 200-206
Publisher
Elsevier BV
Online
2016-05-08
DOI
10.1016/j.apsusc.2016.05.023

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