Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging

Published 2013 View Full Article

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Title
Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging
Authors
Keywords
Electromigration, Pb-free, 3D IC, voids on Al trace, intermetallic compound
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 43, Issue 1, Pages 236-246
Publisher
Springer Nature
Online
2013-10-31
DOI
10.1007/s11664-013-2840-4
References
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