A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters

Authors

Keywords

Journal

Volume 50, Issue 1, Pages 258-269

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Online

2014-10-22

DOI

10.1109/jssc.2014.2357432

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