Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects

Title
Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 117, Issue -, Pages 26-34
Publisher
Elsevier BV
Online
2013-12-10
DOI
10.1016/j.mee.2013.12.003

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