Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging

Published 2013 View Full Article

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Title
Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 582, Issue -, Pages 341-347
Publisher
Elsevier BV
Online
2013-08-11
DOI
10.1016/j.jallcom.2013.08.018

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