Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging

Equivalent mechanical properties of through silicon via interposers – A unit model approach

(2015) Cheng-fu Chen et al.   MICROELECTRONICS RELIABILITY

Impact of high density TSVs on the assembly of 3D-ICs packaging

(2012) C.C. Lee et al.   MICROELECTRONIC ENGINEERING

Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film

(2012) Chang-Chun Lee et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moiré Interferometry

(2010) Jin-Hyoung Park et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Process Development and Reliability of Microbumps

(2010) Sharon Pei-Siang Lim et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

An inverse analysis of warpage for trilayer thin-plate under thermal cycles

(2010) A. Shirazi et al.   MATERIALS & DESIGN

Development of a novel stack package to fabricate high density memory modules for high-end application

(2010) Chinguo Kuo et al.   MICROELECTRONICS RELIABILITY

Reliability challenges in 3D IC packaging technology

(2010) K.N. Tu   MICROELECTRONICS RELIABILITY

Warpage Analysis of Flip-Chip PBGA Packages Subject to Thermal Loading

(2009) Ming-Yi Tsai et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

A hybrid inverse method for evaluating FC-PBGA material response to thermal cycles

(2009) A. Shirazi et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Numerical analysis of thermo-mechanical reliability of through silicon vias (TSVs) and solder interconnects in 3-dimensional integrated circuits

(2009) Leila J. Ladani   MICROELECTRONIC ENGINEERING