Structure and properties of Sn-Cu lead-free solders in electronics packaging
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Title
Structure and properties of Sn-Cu lead-free solders in electronics packaging
Authors
Keywords
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Journal
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
Volume 20, Issue 1, Pages 421-444
Publisher
Informa UK Limited
Online
2019-05-07
DOI
10.1080/14686996.2019.1591168
References
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