Characterization of Sn7In4.1Ag0.5Cu solder in lead‐free composite solder joints of LTCC/PWB assembly

Title
Characterization of Sn7In4.1Ag0.5Cu solder in lead‐free composite solder joints of LTCC/PWB assembly
Authors
Keywords
-
Journal
SOLDERING & SURFACE MOUNT TECHNOLOGY
Volume 20, Issue 3, Pages 11-17
Publisher
Emerald
Online
2008-08-16
DOI
10.1108/09540910810885679

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