标题
Structure and properties of Sn-Cu lead-free solders in electronics packaging
作者
关键词
-
出版物
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
Volume 20, Issue 1, Pages 421-444
出版商
Informa UK Limited
发表日期
2019-05-07
DOI
10.1080/14686996.2019.1591168
参考文献
相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。- Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling
- (2018) Anil Kunwar et al. INTERMETALLICS
- Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction
- (2018) F.Q. Hu et al. MATERIALS LETTERS
- A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
- (2018) Marcelino Dias et al. MICROELECTRONICS RELIABILITY
- Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint
- (2017) Junghwan Bang et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Investigation of microstructure and mechanical properties of Sn-xCu solder alloys
- (2017) A.F. Abd El-Rehim et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Beta-Tin Grain Formation in Aluminum-Modified Lead-Free Solder Alloys
- (2017) Kathlene N. Reeve et al. JOURNAL OF ELECTRONIC MATERIALS
- Wetting of Sn-Zn-Ga and Sn-Zn-Na Alloys on Al and Ni Substrate
- (2017) Tomasz Gancarz et al. JOURNAL OF ELECTRONIC MATERIALS
- Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates
- (2017) M.A.A. Mohd Salleh et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder
- (2017) Huizhen Huang et al. MICROELECTRONICS RELIABILITY
- Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments
- (2017) Jie Wu et al. MICROELECTRONICS RELIABILITY
- On the initial stages of phase formation at the solid Cu/liquid Sn-based solder interface
- (2016) O.Y. Liashenko et al. ACTA MATERIALIA
- Microstructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys
- (2016) Gustavo R. Moreno et al. JOURNAL OF ALLOYS AND COMPOUNDS
- The influence of ageing on the stabilisation of interfacial (Cu,Ni) 6 (Sn,Zn) 5 and (Cu,Au,Ni) 6 Sn 5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints
- (2016) Guang Zeng et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Effect of adding 0.5wt% ZnO nanoparticles, temperature and strain rate on tensile properties of Sn–5.0wt% Sb–0.5wt% Cu (SSC505) lead free solder alloy
- (2016) E.A. Eid et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Effect of Ni to the Cu substrate on the interfacial reaction with Sn-Cu solder
- (2016) Takashi Maeshima et al. MATERIALS & DESIGN
- Differences in the interfacial reaction between Cu substrate and metastable supercooled liquid Sn–Cu solder or solid Sn–Cu solder at 222 °C: Experimental results versus theoretical model calculations
- (2015) O. Yu Liashenko et al. ACTA MATERIALIA
- Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design
- (2015) Jahyun Koo et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient
- (2015) Bismarck Luiz Silva et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Heterogeneous nucleation of Cu 6 Sn 5 in Sn–Cu–Al solders
- (2015) J.W. Xian et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification
- (2015) Xiaowu Hu et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy
- (2015) Li Yang et al. MATERIALS & DESIGN
- Evaluation of solder/substrate thermal conductance and wetting angle of Sn–0.7wt%Cu–(0–0.1wt%Ni) solder alloys
- (2015) Bismarck Luiz Silva et al. MATERIALS LETTERS
- Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu–Al solder alloy
- (2015) Li Yang et al. MICROELECTRONICS RELIABILITY
- Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy
- (2015) Abdoul-Aziz Bogno et al. Journal of Materials Research and Technology-JMR&T
- New Sn–0.7Cu-based solder alloys with minor alloying additions of Pd, Cr and Ca
- (2014) Jahyun Koo et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Co Effects upon Intermetallics Growth Kinetics in Sn-Cu-Co/Ni and Sn-Cu-Co/Cu Couples
- (2014) Yan-lun Tseng et al. JOURNAL OF ELECTRONIC MATERIALS
- Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders
- (2014) L.F. Li et al. MATERIALS & DESIGN
- Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In
- (2013) Guang Zeng et al. INTERMETALLICS
- A new phase in stoichiometric Cu6Sn5
- (2012) Y.Q. Wu et al. ACTA MATERIALIA
- Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging
- (2012) Chi-Yang Yu et al. INTERMETALLICS
- Effects of Ti addition to Sn–Ag and Sn–Cu solders
- (2012) W.M. Chen et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Interfacial Reactions in Sn-Co-(Cu)/Ni Couples With/Without Current Stressing
- (2012) Chih-ming Chen et al. JOURNAL OF ELECTRONIC MATERIALS
- Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions
- (2012) A.A. El-Daly et al. MATERIALS & DESIGN
- Thermomigration in solder joints
- (2012) Chih Chen et al. MATERIALS SCIENCE & ENGINEERING R-REPORTS
- Microstructure and tensile properties of Sn–1Cu lead-free solder alloy produced by directional solidification
- (2012) Xiaowu Hu et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder
- (2012) L.C. Tsao et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Mechanical properties of Sn–0.7Cu/Si3N4 lead-free composite solder
- (2012) M.A.A. Mohd Salleh et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy
- (2011) Satyanarayan et al. ADVANCES IN COLLOID AND INTERFACE SCIENCE
- Microstructure formation in Sn-Cu-Ni solder alloys
- (2011) M. Felberbaum et al. JOM
- Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In
- (2011) A.A. El-Daly et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In
- (2011) A.A. El-Daly et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition
- (2011) Guang Zeng et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Formation of Intermetallics in Sn-0.9Cu and Sn-0.7Cu-0.08Ni Solders
- (2011) Tina Ventura et al. JOURNAL OF ELECTRONIC MATERIALS
- On the root cause of Kirkendall voiding in Cu3Sn
- (2011) Liang Yin et al. JOURNAL OF MATERIALS RESEARCH
- Kinetics of the η–η′ transformation in Cu6Sn5
- (2011) K. Nogita et al. SCRIPTA MATERIALIA
- Effects of solidification kinetics on microstructure formation in binary Sn–Cu solder alloys
- (2010) Tina Ventura et al. ACTA MATERIALIA
- Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples
- (2010) Sinn-wen Chen et al. JOURNAL OF ELECTRONIC MATERIALS
- Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface Between Sn-Cu Solders and a Cu Substrate Due to a Minor Addition of Ni
- (2010) Petr Harcuba et al. JOURNAL OF ELECTRONIC MATERIALS
- Depressing effect of 0.1wt.% Cr addition into Sn–9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal aging
- (2010) Jin Hu et al. MATERIALS CHARACTERIZATION
- Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
- (2010) T. Laurila et al. MATERIALS SCIENCE & ENGINEERING R-REPORTS
- Reliability challenges in 3D IC packaging technology
- (2010) K.N. Tu MICROELECTRONICS RELIABILITY
- Uncovering the driving force for massive spalling in the Sn–Cu/Ni system
- (2010) W.M. Chen et al. SCRIPTA MATERIALIA
- Effects of Ni addition on the interfacial reactions between Sn–Cu solders and Ni substrate
- (2009) Chao-hong Wang et al. INTERMETALLICS
- Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys
- (2009) Kazuhiro Nogita INTERMETALLICS
- Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates
- (2009) K. Nogita et al. JOM
- Effect of addition of nano-copper and extrusion temperature on the microstructure and mechanical response of tin
- (2009) M.E. Alam et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders
- (2009) N. Zhao et al. JOURNAL OF ELECTRONIC MATERIALS
- Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles
- (2009) Yaowu Shi et al. JOURNAL OF ELECTRONIC MATERIALS
- The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging
- (2009) Sun-Kyoung Seo et al. MICROELECTRONICS RELIABILITY
- Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder joints
- (2008) Jin Yu et al. ACTA MATERIALIA
- Interfacial reactions in Sn–(Cu)/Cu6Sn5/Ni couples at 210°C
- (2008) Chao-Hong Wang et al. INTERMETALLICS
- Development of high strength Sn–Cu solder using copper particles at nanolength scale
- (2008) M.E. Alam et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Indentation creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solder alloys
- (2008) R. Mahmudi et al. MATERIALS & DESIGN
- Effects of Co addition in eutectic Sn–3.5Ag solder on shear strength and microstructural development
- (2008) Jung-Sub Lee et al. MICROELECTRONIC ENGINEERING
- Nickel-stabilized hexagonal (Cu,Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys
- (2008) Kazuhiro Nogita et al. SCRIPTA MATERIALIA
- Characterization of Sn7In4.1Ag0.5Cu solder in lead‐free composite solder joints of LTCC/PWB assembly
- (2008) O. Nousiainen et al. SOLDERING & SURFACE MOUNT TECHNOLOGY
- Resonant characteristics of the microelectronic Sn–Cu solder
- (2007) Fei-Yi Hung et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Tensile properties and microstructural characterization of Sn–0.7Cu–0.4Co bulk solder alloy for electronics applications
- (2007) Cristina Andersson et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Effects of rare earth Ce on microstructures, solderability of Sn–Ag–Cu and Sn–Cu–Ni solders as well as mechanical properties of soldered joints
- (2007) Jian-Xin Wang et al. JOURNAL OF ALLOYS AND COMPOUNDS
- A study of nanoparticles in Sn–Ag based lead free solders
- (2007) Masazumi Amagai MICROELECTRONICS RELIABILITY
Discover Peeref hubs
Discuss science. Find collaborators. Network.
Join a conversationAdd your recorded webinar
Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.
Upload Now