Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions

Published 2012 View Full Article

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Title
Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions
Authors
Keywords
-
Journal
MATERIALS & DESIGN
Volume 40, Issue -, Pages 292-298
Publisher
Elsevier BV
Online
2012-04-13
DOI
10.1016/j.matdes.2012.04.007

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