Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In

Published 2011 View Full Article

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Title
Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 509, Issue 34, Pages 8554-8560
Publisher
Elsevier BV
Online
2011-06-27
DOI
10.1016/j.jallcom.2011.05.119

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