On the root cause of Kirkendall voiding in Cu3Sn

Impact of Key Deposition Parameters on the Voiding Sporadically Occurring in Solder Joints with Electroplated Copper

(2010) F. Wafula et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn–3.5Ag solder joints

(2009) J.Y. Kim et al.   ACTA MATERIALIA

Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates

(2009) P.J. Shang et al.   ACTA MATERIALIA

Improving Copper Electrodeposition in the Microelectronics Industry

(2009) Yihua Liu et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder joints

(2008) Jin Yu et al.   ACTA MATERIALIA

Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface

(2008) Y. Liu et al.   JOURNAL OF APPLIED ELECTROCHEMISTRY

Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

(2008) Yi-Shao Lai et al.   JOURNAL OF ELECTRONIC MATERIALS

Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability

(2008) Luhua Xu et al.   JOURNAL OF ELECTRONIC MATERIALS

Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates

(2008) Y.W. Wang et al.   MICROELECTRONICS RELIABILITY

Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints

(2007) P.J. Shang et al.   SCRIPTA MATERIALIA