Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy

Published 2011 View Full Article

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Title
Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy
Authors
Keywords
-
Journal
ADVANCES IN COLLOID AND INTERFACE SCIENCE
Volume 166, Issue 1-2, Pages 87-118
Publisher
Elsevier BV
Online
2011-05-22
DOI
10.1016/j.cis.2011.05.005

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