Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy

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Title
Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy
Authors
Keywords
Solder alloy, Aluminum, Microstructure, Wettability, Mechanical properties
Journal
MATERIALS & DESIGN
Volume 67, Issue -, Pages 209-216
Publisher
Elsevier BV
Online
2014-11-30
DOI
10.1016/j.matdes.2014.11.036

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