Effect of Ni to the Cu substrate on the interfacial reaction with Sn-Cu solder

Published 2016 View Full Article

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Title
Effect of Ni to the Cu substrate on the interfacial reaction with Sn-Cu solder
Authors
Keywords
Soldering, Interface, Diffusion, Thermodynamic modeling, Local equilibrium, Cu, 3, Sn
Journal
MATERIALS & DESIGN
Volume 103, Issue -, Pages 106-113
Publisher
Elsevier BV
Online
2016-05-01
DOI
10.1016/j.matdes.2016.04.068

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