Resonant characteristics of the microelectronic Sn–Cu solder

Title
Resonant characteristics of the microelectronic Sn–Cu solder
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 457, Issue 1-2, Pages 171-176
Publisher
Elsevier BV
Online
2007-04-11
DOI
10.1016/j.jallcom.2007.03.026

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