Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders

Published 2014 View Full Article

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Title
Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders
Authors
Keywords
-
Journal
MATERIALS & DESIGN
Volume 64, Issue -, Pages 15-20
Publisher
Elsevier BV
Online
2014-07-29
DOI
10.1016/j.matdes.2014.07.035

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