Depressing effect of 0.1wt.% Cr addition into Sn–9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal aging

Published 2010 View Full Article

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Title
Depressing effect of 0.1wt.% Cr addition into Sn–9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal aging
Authors
Keywords
-
Journal
MATERIALS CHARACTERIZATION
Volume 61, Issue 3, Pages 355-361
Publisher
Elsevier BV
Online
2010-01-07
DOI
10.1016/j.matchar.2009.12.019

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