The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging

Published 2009 View Full Article

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Title
The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 49, Issue 3, Pages 288-295
Publisher
Elsevier BV
Online
2009-01-05
DOI
10.1016/j.microrel.2008.11.014

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