Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder

Title
Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder
Authors
Keywords
Lead-free solder, Su-Cu, Sulfur, Wettability, Corrosion
Journal
MICROELECTRONICS RELIABILITY
Volume 74, Issue -, Pages 15-21
Publisher
Elsevier BV
Online
2017-06-11
DOI
10.1016/j.microrel.2017.05.010

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