Tensile properties and microstructural characterization of Sn–0.7Cu–0.4Co bulk solder alloy for electronics applications

Title
Tensile properties and microstructural characterization of Sn–0.7Cu–0.4Co bulk solder alloy for electronics applications
Authors
Keywords
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Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 457, Issue 1-2, Pages 97-105
Publisher
Elsevier BV
Online
2007-04-12
DOI
10.1016/j.jallcom.2007.03.028

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