On the initial stages of phase formation at the solid Cu/liquid Sn-based solder interface

Published 2016 View Full Article

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Title
On the initial stages of phase formation at the solid Cu/liquid Sn-based solder interface
Authors
Keywords
Nucleation, Growth, Solder alloy, Cu, 6, Sn, 5, Cu, 3, Sn, TEM characterization
Journal
ACTA MATERIALIA
Volume 117, Issue -, Pages 216-227
Publisher
Elsevier BV
Online
2016-07-19
DOI
10.1016/j.actamat.2016.07.021

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