Beta-Tin Grain Formation in Aluminum-Modified Lead-Free Solder Alloys

Grain refinement of electronic solders: The potential of combining solute with nucleant particles

(2017) H. Shang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Melt undercooling and nucleation kinetics

(2016) J.H. Perepezko et al.   CURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE

Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders

(2016) Z.L. Ma et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Advances in Pb-free Solder Microstructure Control and Interconnect Design

(2016) Kathlene N. Reeve et al.   JOURNAL OF PHASE EQUILIBRIA AND DIFFUSION

Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders

(2016) Kathlene N. Reeve et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

(2016) Kathlene N. Reeve et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Heterogeneous nucleation of Cu 6 Sn 5 in Sn–Cu–Al solders

(2015) J.W. Xian et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying

(2015) J. W. Xian et al.   JOURNAL OF ELECTRONIC MATERIALS

Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys

(2015) Kathlene N. Reeve et al.   JOURNAL OF ELECTRONIC MATERIALS

Heterogeneous nucleation of βSn on NiSn4, PdSn4 and PtSn4

(2014) S.A. Belyakov et al.   ACTA MATERIALIA

Nucleation rates of Sn in undercooled Sn-Ag-Cu flip-chip solder joints

(2013) B. Arfaei et al.   JOURNAL OF APPLIED PHYSICS

Microstructure and Tensile Properties of Sn-1Ag-0.5Cu Solder Alloy Bearing Al for Electronics Applications

(2012) Dhafer Abdul-Ameer Shnawah et al.   JOURNAL OF ELECTRONIC MATERIALS

Influence of Composition on the Morphology of Primary Cu6Sn5 in Sn-4Cu Alloys

(2012) Stuart McDonald et al.   JOURNAL OF ELECTRONIC MATERIALS

Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

(2012) Adam J. Boesenberg et al.   JOURNAL OF ELECTRONIC MATERIALS

Re-investigation of phase equilibria in the system Al–Cu and structural analysis of the high-temperature phase η1-Al1−δCu

(2011) Norbert Ponweiser et al.   INTERMETALLICS

Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature

(2011) B. Arfaei et al.   JOURNAL OF ELECTRONIC MATERIALS

Cyclic twin nucleation in tin-based solder alloys

(2010) L.P. Lehman et al.   ACTA MATERIALIA

Size and Substrate Effects upon Undercooling of Pb-Free Solders

(2009) Yu-chih Huang et al.   JOURNAL OF ELECTRONIC MATERIALS

Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design

(2009) Iver E. Anderson et al.   JOURNAL OF ELECTRONIC MATERIALS

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

(2008) T.R. Bieler et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Alloying modification of Sn–Ag–Cu solders by manganese and titanium

(2008) Li-Wei Lin et al.   MICROELECTRONICS RELIABILITY