Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments

Published 2017 View Full Article

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Title
Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments
Authors
Keywords
Sn-0.3Ag-0.7Cu-1Pr solder, Sn whisker, Aging temperature, Oxygen level
Journal
MICROELECTRONICS RELIABILITY
Volume 79, Issue -, Pages 124-135
Publisher
Elsevier BV
Online
2017-11-06
DOI
10.1016/j.microrel.2017.10.020

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