Nickel-stabilized hexagonal (Cu,Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys

Published 2008 View Full Article

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Title
Nickel-stabilized hexagonal (Cu,Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys
Authors
Keywords
-
Journal
SCRIPTA MATERIALIA
Volume 59, Issue 2, Pages 191-194
Publisher
Elsevier BV
Online
2008-03-15
DOI
10.1016/j.scriptamat.2008.03.002

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