Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Published 2015 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification
Authors
Keywords
Lead-free solder, Cu, 6, Sn, 5, fiber, Microstructure, Directional solidification, Tensile properties
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 625, Issue -, Pages 241-250
Publisher
Elsevier BV
Online
2014-11-21
DOI
10.1016/j.jallcom.2014.10.205

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.