Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

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Title
Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates
Authors
Keywords
Lead-free solder, Reflow soldering, Microstructure, Intermetallic, Interfacial reaction, Shear strength
Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 242, Issue -, Pages 235-245
Publisher
Elsevier BV
Online
2016-11-27
DOI
10.1016/j.jmatprotec.2016.11.031

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