Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

Published 2017 View Full Article

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Title
Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint
Authors
Keywords
Metals and alloys, Intermetallics, Solid state reactions, Mechanical properties, Microstructure
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 728, Issue -, Pages 992-1001
Publisher
Elsevier BV
Online
2017-09-04
DOI
10.1016/j.jallcom.2017.09.011

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