Investigation of microstructure and mechanical properties of Sn-xCu solder alloys

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Title
Investigation of microstructure and mechanical properties of Sn-xCu solder alloys
Authors
Keywords
Sn-Cu solder alloys, Indentation creep properties, Microstructure, Activation energy
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 695, Issue -, Pages 3666-3673
Publisher
Elsevier BV
Online
2016-11-27
DOI
10.1016/j.jallcom.2016.11.371

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