Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

Published 2015 View Full Article

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Title
Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design
Authors
Keywords
Pb-free solders, Sn–Cu, Aluminum alloying, Intermetallic compounds, Solidification
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 650, Issue -, Pages 106-115
Publisher
Elsevier BV
Online
2015-08-05
DOI
10.1016/j.jallcom.2015.08.003

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