Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles

Published 2009 View Full Article

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Title
Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 38, Issue 9, Pages 1866-1873
Publisher
Springer Nature
Online
2009-05-22
DOI
10.1007/s11664-009-0840-1

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