Co Effects upon Intermetallics Growth Kinetics in Sn-Cu-Co/Ni and Sn-Cu-Co/Cu Couples

Phase Equilibria of Sn-Co-Cu Ternary System

(2012) Yu-Kai Chen et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples

(2010) Sinn-wen Chen et al.   JOURNAL OF ELECTRONIC MATERIALS

Impurity and alloying effects on interfacial reaction layers in Pb-free soldering

(2010) T. Laurila et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

(2008) Y.W. Wang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Phase Equilibria of Sn-Co-Ni System and Interfacial Reactions in Sn/(Co, Ni) Couples

(2008) Yi-Hsiang Chao et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Nickel-stabilized hexagonal (Cu,Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys

(2008) Kazuhiro Nogita et al.   SCRIPTA MATERIALIA

Tensile properties and microstructural characterization of Sn–0.7Cu–0.4Co bulk solder alloy for electronics applications

(2007) Cristina Andersson et al.   JOURNAL OF ALLOYS AND COMPOUNDS

A study of nanoparticles in Sn–Ag based lead free solders

(2007) Masazumi Amagai   MICROELECTRONICS RELIABILITY