Effect of adding 0.5wt% ZnO nanoparticles, temperature and strain rate on tensile properties of Sn–5.0wt% Sb–0.5wt% Cu (SSC505) lead free solder alloy

Title
Effect of adding 0.5wt% ZnO nanoparticles, temperature and strain rate on tensile properties of Sn–5.0wt% Sb–0.5wt% Cu (SSC505) lead free solder alloy
Authors
Keywords
Lead-free solder, Sn–Sb–Cu alloy, Microstructure, Composite solder, Mechanical properties
Publisher
Elsevier BV
Online
2016-01-28
DOI
10.1016/j.msea.2016.01.081

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