Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

Published 2015 View Full Article

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Title
Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy
Authors
Keywords
Rapid solidification, Atomization, Solder alloys, Microstructures, Mechanical properties
Journal
Journal of Materials Research and Technology-JMR&T
Volume 4, Issue 1, Pages 84-92
Publisher
Elsevier BV
Online
2015-01-16
DOI
10.1016/j.jmrt.2014.12.005

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