Effects of Ni addition on the interfacial reactions between Sn–Cu solders and Ni substrate

Published 2009 View Full Article

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Title
Effects of Ni addition on the interfacial reactions between Sn–Cu solders and Ni substrate
Authors
Keywords
-
Journal
INTERMETALLICS
Volume 18, Issue 4, Pages 616-622
Publisher
Elsevier BV
Online
2009-11-16
DOI
10.1016/j.intermet.2009.10.018

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