Wetting of Sn-Zn-Ga and Sn-Zn-Na Alloys on Al and Ni Substrate

Microstructural and Hardness Evaluations of a Centrifuged Sn-22Pb Casting Alloy Compared with a Lead-Free SnAg Alloy

(2017) Luz Myrian Satizabal et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

The effects of Na addition on the density, surface tension and viscosity of liquid Sn–Zn alloys

(2016) Tomasz Gancarz et al.   FLUID PHASE EQUILIBRIA

Thermal and mechanical properties of lead-free SnZn–xNa casting alloys, and interfacial chemistry on Cu substrates during the soldering process

(2016) Tomasz Gancarz et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Wetting and Interfacial Chemistry of Sn-Zn-Ga Alloys with Cu Substrate

(2016) Tomasz Gancarz et al.   JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE

Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys

(2016) Wislei R. Osório et al.   SCIENCE AND TECHNOLOGY OF WELDING AND JOINING

Physical, Thermal, Mechanical Properties, and Microstructural Characterization of Sn-9Zn-XGa Alloys

(2015) Tomasz Gancarz   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Microstructure, thermal analysis and damping properties of Ag and Ni nano-particles doped Sn–8Zn–3Bi solder on OSP–Cu substrate

(2014) Asit Kumar Gain et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Structure and properties of lead-free solders bearing micro and nano particles

(2014) Liang Zhang et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

Bulk and Surface Properties of Liquid Al-Li and Li-Zn Alloys

(2014) Marcela Trybula et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

(2013) Chih-Yao Liu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Physicochemical Properties of Sn-Zn and SAC + Bi Alloys

(2012) Tomasz Gancarz et al.   JOURNAL OF ELECTRONIC MATERIALS

Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic Alloys

(2012) Janusz Pstruś et al.   JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE

Wetting of Al pads by Sn–8.8Zn and Sn–8.7Zn–1.5(Ag, In) alloys

(2012) Przemysław Fima et al.   JOURNAL OF MATERIALS SCIENCE

Phase transition temperatures of Sn–Zn–Al system and their comparison with calculated phase diagrams

(2012) Bedřich Smetana et al.   JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY

Microstructure design and dissolution behavior between 2024 Al/Sn with the ultrasonic-associated soldering

(2012) Yuanxing Li et al.   MATERIALS & DESIGN

Kinetic analysis of Ni5Zn21 growth at the interface between Sn–Zn solders and Ni

(2011) Chao-hong Wang et al.   INTERMETALLICS

Electrochemical behavior of a lead-free SnAg solder alloy affected by the microstructure array

(2011) Wislei R. Osório et al.   MATERIALS & DESIGN

Thermochemical and phase diagram studies of the Sn–Zn–Ni system

(2011) V.D. Gandova et al.   THERMOCHIMICA ACTA

Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

(2010) Yee-Wen Yen et al.   JOURNAL OF ELECTRONIC MATERIALS

Mechanical Properties and Electrochemical Corrosion Behavior of Al/Sn-9Zn-xAg/Cu Joints

(2010) M. L. Huang et al.   JOURNAL OF ELECTRONIC MATERIALS

Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C

(2010) Jaewon Chang et al.   JOURNAL OF ELECTRONIC MATERIALS

Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C

(2010) Chao-hong Wang et al.   JOURNAL OF ELECTRONIC MATERIALS

Interfacial Reactions Between Sn-Zn Alloys and Ni Substrates

(2009) WenJun Zhu et al.   JOURNAL OF ELECTRONIC MATERIALS

Interfacial Reactions of Sn-9Zn-xCu (x = 1, 4, 7, 10) Solders with Ni Substrates

(2009) Wei-kai Liou et al.   JOURNAL OF ELECTRONIC MATERIALS

Globular-to-needle Zn-rich phase transition during transient solidification of a eutectic Sn–9%Zn solder alloy

(2009) Leonardo R. Garcia et al.   MATERIALS LETTERS

Microstructures of eutectic Sn–Ag–Zn solder solidified with different cooling rates

(2007) C. Wei et al.   JOURNAL OF ALLOYS AND COMPOUNDS