Microstructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys

Published 2016 View Full Article

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Title
Microstructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys
Authors
Keywords
Impulse atomization, Microstructure, Solders, Hardness, Wettability
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 680, Issue -, Pages 259-267
Publisher
Elsevier BV
Online
2016-04-17
DOI
10.1016/j.jallcom.2016.04.129

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